Sealed package and method of forming same

ABSTRACT

Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

BACKGROUND

Various systems require electrical coupling between electrical devicesdisposed within a hermetically sealed enclosure and external devices.Oftentimes, such electrical coupling needs to withstand variousenvironmental factors such that a conductive pathway or pathways from anexternal surface to within the enclosure remains stable. For example,implantable medical devices (IMDs), e.g., cardiac pacemakers,defibrillators, neurostimulators, and drug pumps, which can includeelectronic circuitry and battery elements, require an enclosure orhousing to contain and hermetically seal these elements when the IMD isdisposed within a body of a patient. Many of these IMDs include one ormore electrical feedthrough assemblies to provide electrical connectionsbetween the elements contained within the housing and components of theIMD external to the housing. For example, one or more sensors,electrodes, and lead wires can be mounted on an exterior surface of thehousing and electrically connected to one or more elements disposedwithin the housing. Further, electrical contacts can be housed within aconnector header that is mounted on the housing to provide coupling forone or more implantable leads, which typically carry one or moreelectrodes or other types of physiological sensors. A physiologicalsensor, for example a pressure sensor, incorporated within a body of alead may also require a hermetically sealed housing to containelectronic circuitry of the sensor and an electrical feedthroughassembly to provide electrical connection between one or more leadwires, which extend within the implantable lead body, and the containedcircuitry.

An IMD can also include one or more transparent portions that canprovide a window for transmission of electromagnetic radiation into andout of the housing. For example, an IMD can include an optical sensorthat transmits and receives electromagnetic radiation through atransparent window disposed in the housing. Such transparent windowtypically includes a nonconductive material that is connected to one ormore conductive portions of the housing such that the window ishermetically-sealed to the conductive portions.

SUMMARY

In general, the present disclosure provides various embodiments of ahermetically-sealed package and a method of forming such package. Thepackage can include a housing that has a transparent portion that isconnected to at least one opaque portion. The package can also include apower source disposed within the housing and an inductive coil alsodisposed within the housing such that at least a portion of theinductive coil is disposed within the transparent portion. The inductivecoil can be electrically connected to the power source. In one or moreembodiments, an inductive charging system can be utilized to charge thepower source via the inductive coil. For example, thehermetically-sealed package can be utilized as an implantable medicaldevice that can be implanted within a patient's body and charged whileimplanted.

In one aspect, the present disclosure provides a hermetically-sealedpackage that includes a housing that extends along a housing axisbetween a first end and a second end, where the housing includes firstand second opaque portions and a transparent portion disposed betweenthe first and second opaque portions. The first opaque portion ishermetically sealed to a first end of the transparent portion, and thesecond opaque portion is hermetically sealed to a second end of thetransparent portion. At least one of the first and second opaqueportions is hermetically sealed to the transparent portion by a weldring. The package further includes a power source disposed within thehousing and an inductive coil disposed at least partially within thetransparent portion of the housing and electrically connected to thepower source.

In another aspect, the present disclosure provides a housing assemblythat includes a housing having an outer surface and extending along ahousing axis between a first end and a second end, and a weld ringcompression bonded to the outer surface of the housing such that theweld ring is hermetically-sealed to the outer surface of the housing.

In another aspect, the present disclosure provides a method of forming ahermetically-sealed package that includes a housing that extends along ahousing axis between a first end and a second end. The method includescompression bonding a weld ring to an outer surface of a transparentportion of the housing. Compression bonding the weld ring includesheating the weld ring, disposing the weld ring over the outer surface ofthe transparent portion of the housing, and cooling the weld ring.

All headings provided herein are for the convenience of the reader andshould not be used to limit the meaning of any text that follows theheading, unless so specified.

The terms “comprises” and variations thereof do not have a limitingmeaning where these terms appear in the description and claims. Suchterms will be understood to imply the inclusion of a stated step orelement or group of steps or elements but not the exclusion of any otherstep or element or group of steps or elements.

In this application, terms such as “a,” “an,” and “the” are not intendedto refer to only a singular entity but include the general class ofwhich a specific example may be used for illustration. The terms “a,”“an,” and “the” are used interchangeably with the term “at least one.”The phrases “at least one of” and “comprises at least one of” followedby a list refers to any one of the items in the list and any combinationof two or more items in the list.

The phrases “at least one of” and “comprises at least one of” followedby a list refers to any one of the items in the list and any combinationof two or more items in the list.

As used herein, the term “or” is generally employed in its usual senseincluding “and/or” unless the content clearly dictates otherwise.

The term “and/or” means one or all of the listed elements or acombination of any two or more of the listed elements.

As used herein in connection with a measured quantity, the term “about”refers to that variation in the measured quantity as would be expectedby the skilled artisan making the measurement and exercising a level ofcare commensurate with the objective of the measurement and theprecision of the measuring equipment used. Herein, “up to” a number(e.g., up to 50) includes the number (e.g., 50).

Also herein, the recitations of numerical ranges by endpoints includeall numbers subsumed within that range as well as the endpoints (e.g., 1to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, 5, etc.).

These and other aspects of the present disclosure will be apparent fromthe detailed description below. In no event, however, should the abovesummaries be construed as limitations on the claimed subject matter,which subject matter is defined solely by the attached claims, as may beamended during prosecution.

BRIEF DESCRIPTION OF THE DRAWINGS

Throughout the specification, reference is made to the appendeddrawings, where like reference numerals designate like elements, andwherein:

FIG. 1 is a schematic perspective view of one embodiment of ahermetically-sealed package.

FIG. 2 is a schematic cross-section view of the hermetically-sealedpackage of FIG. 1.

FIG. 3 is a schematic exploded view of the hermetically-sealed packageof FIG. 1.

FIG. 4 is a schematic exploded view of one embodiment of a housingassembly.

FIG. 5 is a schematic cross-section view of the housing assembly of FIG.4.

FIG. 6 is a schematic cross-section view of a portion of anotherembodiment of a housing assembly.

FIG. 7 is a schematic front view of another embodiment of a housingassembly.

FIG. 8 is a schematic cross-section view of a portion of anotherembodiment of a housing assembly.

FIG. 9 is a flowchart of one embodiment of a method of compressionmolding a weld ring to a housing.

FIG. 10 is a schematic view of one embodiment of an implantable medicaldevice assembly.

DETAILED DESCRIPTION

In general, the present disclosure provides various embodiments of ahermetically-sealed package and a method of forming such package. Thepackage can include a housing that has a transparent portion that isconnected to at least one opaque portion. The package can also include apower source disposed within the housing and an inductive coil alsodisposed within the housing such that at least a portion of theinductive coil is disposed within the transparent portion. The inductivecoil can be electrically connected to the power source. In one or moreembodiments, an inductive charging system can be utilized to charge thepower source via the inductive coil. For example, thehermetically-sealed package can be utilized as an implantable medicaldevice that can be implanted within a patient's body and charged whileimplanted.

In one or more embodiments, the hermetically-sealed package can beformed using low-temperature techniques that do not require the use ofhigh-temperature brazing materials. Further, in one or more embodiments,the hermetically-sealed package can be formed without creatingunacceptable stresses in the materials used to form the package that canbe caused by use of high-temperature bonding techniques to connect oneor more transparent portions to one or more conductive portions of thehousing of the package. For example, one or more embodiments ofhermetically-sealed packages described herein can be formed utilizing alow-temperature compression bonding technique to connect one or moreweld rings to the transparent portion of the housing. Such weld ringscan also be utilized to connect one or more opaque portions to thetransparent portion using any suitable technique, e.g., welding, laserwelding, diffusion bonding, laser-assisted diffusion bonding, etc.

FIGS. 1-3 are various views of one embodiment of a hermetically-sealedpackage 10. The package 10 includes a housing 12 that extends along ahousing axis 2 between a first end 14 and a second end 16. The housing12 includes first and second opaque portions 18, 20 and a transparentportion 22 disposed between the first and second opaque portions. In oneor more embodiments, the first opaque portion 18 is hermetically sealedto a first end 24 of the transparent portion 22, and the second opaqueportion 20 is hermetically sealed to a second end 28 of the transparentportion. At least one of the first and second opaque portions 18, 20 ishermetically sealed to the transparent portion 22 by a weld ring (e.g.,first weld ring 26 and/or second weld ring 30). The hermetically-sealedpackage 10 also includes a power source 32 (FIG. 2) disposed within thehousing 12 and an inductive coil 34 disposed at least partially withinthe transparent portion 22 of the housing 12 and electrically connectedto the power source.

In general, the housing 12 can have any suitable dimensions, e.g., thehousing can have any suitable length as measured in a direction parallelto the housing axis 2 between the first end 14 and the second end 16.Further, each of the first and second opaque portions 18, 20 and thetransparent portion 22 can have any suitable dimensions.

The housing 12 includes the first and second opaque portions 18, 20.Although depicted as including two opaque portions 18, 20, the housing12 can include any suitable number of opaque portions, e.g., one, two,three, four, or more opaque portions. For example, in one or moreembodiments, the housing 12 can include one opaque portion that isconnected to either the first end 24 or the second end 28 of thetransparent portion 22.

The first and second opaque portions 18, 20 can take any suitable shapeor shapes. For example, at least one of the first and second opaqueportions 18, 20 can take any suitable shape in a plane orthogonal to thehousing axis 2. In the embodiment illustrated in FIGS. 1-3, each of thefirst and second opaque portions 18, 20 takes an elliptical (e.g.,circular) shape in the plane orthogonal to the housing axis 2. Each ofthe first and second opaque portions 18, 20 can also have an area in theplane orthogonal to the housing axis 2 that is constant or varies in adirection parallel to the housing axis. For example, as shown in FIG. 1,the first opaque portion 18 has an area in the plane orthogonal to thehousing axis 2 that decreases in a direction from the second end 16 ofthe housing to the first end 14. Further, for example, the first andsecond opaque portions 18, 20 can take any suitable shape or shapes in aplane parallel to the housing axis 2. In the illustrated embodiment, thefirst opaque portion 18 takes a curved shape in the plane parallel tothe housing axis 2, and the second opaque portion 20 takes a rectangularshape in the plane parallel to the housing axis.

One or more portions of the at least one of the first and second opaqueportions 18, 20 can be hollow to provide a cavity having any suitabledimensions. In one or more embodiments, at least one of the first andsecond opaque portions 18, 20 can be solid.

The first and second opaque portions 18, 20 can include any suitablematerial or materials, e.g., metal, polymeric, ceramic, or inorganicmaterials. In one or more embodiments, the first and second opaqueportions 18, 20 can include at least one of glass, quartz, silica,sapphire, silicon carbide, diamond, and gallium nitride. In one or moreembodiments, the first and second opaque portions 18, 20 can include atleast one of copper, silver, titanium, niobium, zirconium, tantalum,stainless steel, platinum, iridium. Further, in one or more embodiments,the first and second opaque portions 18, 20 can include biocompatiblematerials such that the package 10 can be implanted within a patient'sbody. Further, one or more coatings or layers can be disposed on outersurfaces of the first and second opaque portions 18, 20 that providebiocompatibility. In one or more embodiments, at least one of the firstand second opaque portions 18, 20 can be electrically conductive toprovide a ground electrode for the package 10 as is known in the art. Inone or more embodiments, one or more portions of the first and secondopaque portions 18, 20 can be nonconductive.

Further, at least a portion of the housing 12 can be substantiallytransmissive at a desired wavelength or range of wavelengths or adesired frequency or range of frequencies. For example, in theembodiment illustrated in FIGS. 1-3, the housing 12 includes thetransparent portion 22 disposed between the first and second opaqueportions 18, 20. As used herein, the term “transparent” means that oneor more portions of the housing transmits to electromagnetic radiationof any desired wavelength or frequency. For example, in one or moreembodiments, the transparent portion 22 can be transparent toradio-frequency (RF) electromagnetic radiation.

Although depicted as including one transparent portion 22, the housing12 can include any suitable number of transparent portions. In one ormore embodiments, the transparent portion 22 can be disposed within oneor both of the first and second opaque portions 18, 20. Further, thetransparent portion 22 can take any suitable shape or shapes and haveany suitable dimensions. In the embodiment illustrated in FIGS. 1-3, thetransparent portion 22 takes an elliptical (e.g., circular) shape in theplane orthogonal to the housing axis 2. The transparent portion 22 canhave a constant area in the plane perpendicular to the housing axis 2 oran area that changes in a direction parallel to the housing axis.Further, the transparent portion 22 can take a rectangular shape in theplane parallel to the housing axis 2.

The transparent portion 22 of the housing 12 can include any suitablematerial or materials that are substantially transmissive to one or morewavelengths or frequencies of electromagnetic radiation, e.g., at leastone of glass, quartz, silica, sapphire, silicon carbide, diamond, andgallium nitride. In one or more embodiments, the transparent portion 22can include a ceramic material. Further, in one or more embodiments, thetransparent portion 22 can include a nonconductive (i.e., dielectric)material.

As used herein, the phrase “substantially transmissive” means that thetransparent portion 22 transmits greater than 50% of electromagneticradiation incident on the transparent portion for a selected wavelengthor range of wavelengths, or a selected frequency or range offrequencies. In one or more embodiments, the transparent portion 22 canbe substantially transmissive to electromagnetic radiation having afrequency in a range of 10 kHz to 20 MHz. In one or more embodiments,the transparent portion 22 can be substantially transmissive to at leastone of UV light, visible light, and IR light. In one or moreembodiments, the transparent portion 22 can be substantiallytransmissive such that the electronic devices 36 can include one or moreoptical sensors that can be utilized to detect one or more preselectedexternal conditions, e.g., blood oxygen levels. In one or moreembodiments, the transparent portion 22 can be substantiallytransmissive to radio-frequency (RF) electromagnetic radiation such thatthe package 10 can be remotely charged utilizing an RF charging systemas is further described herein.

In one or more embodiments, one or more portions of the transparentportion 22 can be hollow to provide a cavity or cavities having anysuitable dimensions. In one or more embodiments, the transparent portion22 can be solid.

The first and second opaque portions 18, 20 can be connected to thetransparent portion 22 using any suitable technique or techniques. Inone or more embodiments, the first opaque portion 18 can be connected tothe transparent portion 22 by the first weld ring 26. Further the secondopaque portion 20 can be connected to the transparent portion 22 by thesecond weld ring 30. The housing 12, transparent portion 22, first weldring 26, and second weld ring 30 combine to provide a housing assembly4. Although depicted as including the first and second weld rings 26,30, the assembly 10 can include only the second weld ring, and the firstopaque portion 18 can be connected to the transparent portion 22 usingany suitable technique or techniques, e.g., welding, laser welding,diffusion bonding, laser-assisted diffusion bonding, etc., without theuse of the first weld ring. For example, in one or more embodiments, thefirst opaque portion 18 can be connected to the transparent portion 22by a feedthrough header plate that is diffusion bonded to thetransparent portion. Similarly, in one or more embodiments, the assembly10 can include only the first weld ring 26, and the second opaqueportion 20 can be connected to the transparent portion 22 using anysuitable technique or techniques, e.g., welding, laser welding,diffusion bonding, laser-assisted diffusion bonding, etc., without theuse of the second weld ring.

The weld rings 26, 30 can include any suitable material or materials,e.g., copper, silver, titanium, niobium, zirconium, tantalum, stainlesssteel, platinum, iridium, and combinations thereof. In one or moreembodiments, the weld rings 26, 30 can include two or more materials,e.g., bi-metals, clad laminates, etc. In one or more embodiments, theweld rings 26, 30 can include any suitable bio-compatible and weldablematerials. Further, the weld rings 26, 30 can take any suitable shapeand have any suitable dimensions. In one or more embodiments, the firstweld ring 26 can be hermetically sealed to one or both of thetransparent portion 22 and the first opaque portion 18. Further, in oneor more embodiments, the second weld ring 30 can be hermetically sealedto one or both of the transparent portion 22 and the second opaqueportion 20.

The weld rings 26, 30 can be sealed to the opaque portions 18, 20 andthe transparent portion 22 using any suitable technique or techniques,e.g., diffusion bonding, laser diffusion bonding, compression bonding.In one or more embodiments, the weld rings 26, 30 are first connected tothe transparent portion 22 and then attached to the respective opaqueportions 18, 20.

The first weld ring 26 can be connected to any suitable portion orportions of the transparent portion 22 and any suitable portion orportions of the first opaque portion 18. Similarly, the second weld ring30 can be connected to any suitable portion or portions of thetransparent portion 22 and any suitable portion or portions of thesecond opaque portion 20. In one or more embodiments, one or both of thefirst and second weld rings 26, 30 can be connected to an outer surface23 of the transparent portion 22. Further, in one or more embodiments,the first weld ring 26 can be connected to an outer surface 19 of thefirst opaque portion 18, and the second weld ring 30 can be connected toan outer surface 21 of the second opaque portion 20.

In one or more embodiments, at least one of the first and second weldrings 26, 30 can include a flange or recessed portion that is adapted tomate with a flange or recessed portion of one or both of the opaqueportions 18, 20 and the transparent portion 22. For example, the firstweld ring 26 can be connected to a flange 54 (FIG. 3) of the firstopaque portion 18 and a flange 58 of the transparent portion 22.Further, the second weld ring 30 can be connected to a flange 56 of thesecond opaque portion 20 and a flange 60 of the transparent portion 22.

Further, for example, FIGS. 4-5 are various views of one embodiment of ahousing assembly 100. The housing assembly 100 can be utilized with anysuitable device or system, e.g., the hermetically-sealed package 10 ofFIGS. 1-3. All of the design considerations and possibilities regardingthe housing assembly 4 of FIGS. 1-3 apply equally to the housingassembly 100 of FIGS. 4-5.

The housing assembly 100 includes a housing 110 that has an outersurface 112 and extends along a housing axis 102 between a first end 114and a second end 116 of the housing. The housing 110 can include anysuitable number of transparent portions and opaque portions. Theassembly 100 also includes a first weld ring 118 connected to the outersurface 112 of the housing 110. In one or more embodiments, the assembly100 also includes a second weld ring 120 also connected to the outersurface 112 of the housing 110. Although depicted as including two weldrings 118, 120, the assembly 100 can include any suitable number of weldrings. For example, in one or more embodiments, the assembly includesthe first weld ring 118 and not the second weld ring 120 or vice versa.

The housing 110 can include any suitable material or materials, e.g.,the materials described herein regarding the first and second opaqueportions 18, 20 and the transparent portion 22 of the package 10 ofFIGS. 1-3. Further, the weld rings 118, 120 can include any suitablematerial or materials, e.g., the materials described herein regardingweld rings 26, 30 of package 10 of FIGS. 1-3.

In one or more embodiments, the housing 110 can include a flange 122disposed adjacent to the first end 114 of the housing. As used herein,the term “adjacent to the first end of the housing” means that anelement or component is disposed closer to the first end 114 of thehousing 110 than to the second end 116 of the housing. Further, thehousing 110 includes a second flange 124 disposed adjacent to the secondend 116 of the housing. As used herein, the term “adjacent to the secondend of the housing” means that an element or component is disposedcloser to the second end 116 of the housing 110 than to the first 114end of the housing. The flanges 122, 124 can be adapted such that theweld rings 118, 120 can be disposed over the flanges and connected tothe housing 110 using any suitable technique or techniques. In one ormore embodiments, one or both of the weld rings 118, 120 can becompression bonded to the outer surface 112 of the housing 110 as isfurther described herein. In one or more embodiments, the weld rings118, 120 can be connected to the outer surface 112 of the housing 110such that the weld rings are hermetically sealed to the outer surface ofthe housing. In one or more embodiments, a diffusion layer (not shown)can be disposed between one or both of the weld rings 118, 120 and theouter surface 112 of the housing 110 that is formed when the weld ringsare compression bonded to the outer surface of the housing. Suchdiffusion layer can have any suitable thickness. Although not shown, oneor more crush ribs can be disposed on one or both flanges 122, 124 thatare adapted to at least partially collapse when the weld rings 118, 120are disposed onto the flanges.

The weld rings 118, 120 can each have an inner diameter 126 as shown inFIG. 5, which is an end view of the housing assembly 100 of FIG. 4 andillustrates the first weld ring 118 connected to the outer surface 112of the housing 110. As shown in FIG. 5, the housing 110 has an outerdiameter 128 where the weld rings 118, 120 are connected. In one or moreembodiments, the inner diameter 126 of each of the weld rings 118, 120can be greater than the outer diameter 128 of the outer surface 112 ofthe housing 110 at the portion of the housing that is connected to theweld rings.

In one or more embodiments, one or both of the weld rings 118, 120 canbe compression bonded to the housing 110. Such compression bonding canbe applied to a region of the housing 110 that includes notched orflanged edges as one or both of the weld rings 118, 120 are connected tothe housing using heat shrink techniques.

In one or more embodiments, a thin metal film or layer (e.g., titaniumor niobium) may be applied to the bonding surface of the housing 110,and any suitable bonding technique can be utilized to bond one or bothof the weld rings 118, 120 to the housing such that the thin metal filmor layer is disposed between the weld rings and the transparent portion.In one or more embodiments, the thin metal film or layer can assist withbonding between the weld rings 118, 120 and the housing 110. The thinmetal film or layer can have any suitable thickness, e.g., at least 500nm and no greater than 5000 nm.

A compression force can be applied axially to the assembly 100 to assistin connecting the first and second weld rings 118, 120 to the housing110. In one or more embodiments, the first and second weld rings 118,120 are hermetically sealed to the housing 110 of the housing assembly100. In one or more embodiments, the weld rings 118, 120 can be utilizedto connect the housing 110 to one or more additional transparent oropaque portions utilizing any suitable technique or techniques.

The flanges 122, 124 of the housing 110 can take any suitable shape andhave any suitable dimensions. In one or more embodiments, one or both ofthe weld rings 118, 120 can also include a flange that is adapted to bereceived by the flanges 122, 124 of the housing 110. For example, FIG. 6is a schematic cross-section view of a portion of a housing assembly200. All of the design considerations and possibilities regarding thehousing assembly 100 of FIGS. 4-5 apply equally to the housing assembly200 of FIG. 6.

The housing assembly 200 includes a housing 202 and a weld ring 212.Housing 202 includes a flange 204 that has a tapered portion 206.Further, the weld ring 212 has a flange 214 that includes a taperedportion 216. The tapered portion 206 of the flange 204 of the housing202 is adapted to receive the tapered portion 216 of the flange 214 ofthe weld ring 212. The tapered portions 206, 216 are adapted to allowthe weld ring 212 to more easily slide onto an outer surface 203 of thehousing 202. In one or more embodiments, a gap 220 can be formed betweena straight portion 218 of the flange 214 of the weld ring 212 and astraight portion 208 of the flange 204 of the housing 202. Further, inone or more embodiments, a gap 222 can be formed between the weld ring212 and an end 210 of the housing 202. Each of the gaps 220, 222 can beany suitable length.

Any suitable technique or techniques can be utilized to connect the weldring 212 to the housing, e.g., welding, laser welding, bonding,diffusion bonding, laser assisted diffusion bonding, etc. In one or moreembodiments, the weld ring 212 can be hot press thermal diffusion bondedto the housing 202 as is further described herein.

As stated herein, a weld ring can be connected to transparent and opaqueportions of a housing using any suitable technique or techniques. In oneor more embodiments, one or more weld rings can be connected to thehousing using a butt joint. For example, FIG. 7 is a schematic frontview of another embodiment of a housing assembly 300. All of the designconsiderations and possibilities regarding the housing assembly 100 ofFIGS. 4-5 apply equally to the housing assembly 300 of FIG. 7. Thehousing assembly 300 includes a housing 302 connected to a first weldring 304 and second weld ring 306. The first weld ring 304 is connectedto the housing 302 adjacent to a first end 308 of the portion, and thesecond weld ring 306 is connected to the housing 302 adjacent to asecond end 310 of the housing.

A side surface of the first end 308 of the housing 302 is connected to aside surface of the first weld ring 304. Further, a side surface of thesecond end 310 of the housing 302 is connected to a side surface of thesecond weld ring 306. Any suitable technique or techniques can beutilized to connect the weld rings 304, 306 to the housing 302, e.g.,welding, laser welding, bonding, diffusion bonding, laser assisteddiffusion bonding, etc. In one or more embodiments, the weld rings 304,306 can be diffusing bonded to the housing 302 using any suitablediffusion bonding technique. For example, hot press thermal diffusionbonding can be used for various edge surfaces on the housing 302, e.g.,butt joint, notched edges, tapered edges, etc. A uniaxial load (e.g.,1-4 Megapascals) can be applied to the weld rings 304, 306 and thehousing using any suitable technique at a temperature of 600-1000° C.for any suitable time period, e.g., at least 10 minutes to no greaterthan 10 hours, under a high vacuum or inert gas such as argon.

As mentioned herein, one or both of the housing and weld rings of thehousing assemblies described herein can include a flange. For example,FIG. 8 is a schematic cross-section of another embodiment of housingassembly 400. All of the design considerations and possibilitiesregarding the housing assembly 100 of FIGS. 4-5 apply equally to thehousing assembly 400 of FIG. 8. The assembly 400 includes a housing 402and first and second weld rings 404, 406. The housing 402 can includeone or more transparent portions, e.g., transparent portion 22 ofFIG. 1. In one or more embodiments, the entire housing 402 istransparent to any suitable wavelength or wavelengths. The first weldring 404 is connected to the housing 402 adjacent to a first end 408 ofthe housing, and a second weld ring 406 is connected to the housingadjacent to a second end 410 of the housing.

The first end 408 of the housing 402 includes a flange 412 that isadapted to mate with a flange 416 of the first weld ring 404. Further,the second end 410 of the housing 402 includes a flange 414 that isadapted to mate with a flange 418 of the second weld ring 406. The firstand second weld rings 404, 406 can be connected to the housing 402 ofthe housing assembly 400 using any suitable technique or techniques.

In general, the weld rings 404, 406 can be hermetically sealed to thehousing 402 by a bond. Any suitable technique or techniques can beutilized to form such bond, e.g., laser diffusion bonding at aninterface 420 between flange 412 of the housing 402 and the flange 416of the first weld ring 420, thermal diffusion bonding between flanges414, 416 and the housing, etc. In one or more embodiments, one or bothof the weld rings 404, 406 can be hermetically sealed to the housing 402utilizing the laser diffusion bonding techniques described in co-ownedand co-filed U.S. Patent Publication No. 2016/0185081, entitledKINETICALLY LIMITED NANO-SCALE DIFFUSION BOND STRUCTURES AND METHODS.For example, electromagnetic radiation 401 (e.g., light) can be directedthrough the housing 402 (e.g., a transparent portion of the housing)from its outer surface 403 and focused at an interface 420 between theflange 412 of the housing and the flange 416 of the first weld ring 404.Further, electromagnetic radiation can be directed through the housing402 from the outer surface 403 and focused at an interface 422 betweenthe flange 414 of the housing and the flange 418 of the second weld ring406. In one or more embodiments, a uniaxial load may be applied duringthe laser bonding process to maintain contact between the weld rings404, 406 and the housing 402.

Any suitable electromagnetic radiation can be utilized to form the bond.In one or more embodiments, the electromagnetic radiation can includelaser light that can include any suitable wavelength or range ofwavelengths. In one or more embodiments, the laser light can includelight having a wavelength of at least 200 nm. In one or moreembodiments, the laser light can include a wavelength of no greater than10,000 nm. For example, laser light can include UV light, visible light,IR light, and combinations thereof. In one or more embodiments, a UVlaser can be utilized to provide light having a wavelength of about 300nm and a pulse width of 10 ns. In one or more embodiments, the materialsfor the housing 402 and the weld rings 404, 406, and the power level andwavelength of the light used may be selected such that the light may notdirectly damage, ablate, warp, or cut the external contacts and thehousing, and such that the external contacts and the housing retaintheir bulk properties.

In general, light can be provided by any suitable laser or laser system.For example, the laser may generate light having a relatively narrow setof wavelengths (e.g., a single wavelength). The light emitted by thelaser may form a collimated beam that may not be focused at a particularpoint. The light emitted by the laser may be focused at the interfaces416, 418 to generate a laser bond.

Although the laser may provide light that has a narrow range ofwavelengths, in one or more embodiments, the laser may represent one ormore devices that emit light having a wider range of wavelengths than asingle typical laser. A wide variety of devices may be used to emitlight having a narrow or wide range of wavelengths. In one or moreembodiments, the laser may include one or more laser devices includingdiode and fiber lasers. Laser sources may also include, e.g., TIsapphire, argon ion, Nd:YAG, XeF, HeNe, Dye, GaAs/AlGaAs, CO₂,Alexandrite, InGaAs, InGaAsP, Nd:glass, Yb:YAG, or Yb fiber lasers. Thelaser device may also include one of continuous wave, modulated, orpulsed modes. Accordingly, a wide variety of laser devices may be usedin the bonding process. In one or more embodiments, a power level of thelaser may be set to approximately 1 W, distributed across theapproximate focused beam diameter of 10 μm, with a top hat or Gaussianspatial energy profile.

As mentioned herein, the weld rings 26, 30 of the housing assembly 4 ofFIGS. 1-3 can be connected to the transparent portion 22 and the opaqueportions 18, 20 using any suitable technique or techniques. For example,FIG. 9 is a flowchart of one embodiment of a method 500 of compressionbonding one or both of the weld rings 26, 30 onto the outer surface 23of the transparent portion 22 of the housing 12. Although described inreference to the hermetically-sealed package 10 of FIGS. 1-3, the method500 can be utilized to form any suitable hermetically sealed package orhousing assembly (e.g., housing assembly 100 of FIG. 4). The methodincludes compression bonding the weld ring (e.g., first weld ring 26) tothe outer surface 23 of the transparent portion 22 of the housing 12.Compression bonding the first weld ring 26 includes heating at least oneof the weld ring and the transparent portion 22 using any suitabletechnique or techniques at 502. In one or more embodiments, thematerials utilized to form the weld ring 26 and the transparent portion22 can have differing coefficients of thermal expansion such that theweld ring expands to a greater extent than that of the transparentportion.

The weld ring 26 can be heated to any suitable temperature such that theinner diameter of the weld ring increases until it is greater than anouter diameter of a portion of the outer surface 23 of the transparentportion 22 of the housing 12 upon which the weld ring will be placed. Inone or more embodiments, the first weld ring 26 can be heated to atemperature of at least 300° C. and no greater than 800° C. At 504, thefirst weld ring 26 is disposed over the outer surface 23 of thetransparent portion 22 of the housing 12. In one or more embodiments,the first weld ring 26 can be slid over the outer surface 23 of thetransparent portion 22 until the weld ring is in the desired position.Further, in one or more embodiments, one or both of the first weld ring26 and the transparent portion 22 can include one or more flanges asdescribed herein. At 506, the first weld ring 26 is cooled such that theinner diameter of the weld ring contracts and the weld ring comes intocontact with the outer surface 23 of the transparent portion 22,hermetically sealing the weld ring to the transparent portion. Pressurecan be applied to an end surface of the first weld ring 26 to constrainmaintain contact between the first weld ring and the transparent portion23 as the first weld ring cools. In one or more embodiments, a metallayer can be disposed on the outer surface 23 of the transparent portion22 of the housing 12 prior to disposing the first weld ring 26 over theouter surface of the transparent portion such that metal layer isdisposed between the weld ring and the outer surface. The metal layercan assist in hermetically sealing the weld ring 26 to the transparentportion 22 of the housing 12. The metal layer can include any suitablematerial or materials as described herein.

In one or more embodiments, a second weld ring (e.g. second weld ring30) can be compression bonded to the outer surface 23 of the transparentportion 22 of the housing 12, where the first weld ring 26 iscompression bonded adjacent to the first end 24 of the transparentportion of the housing and the second weld ring is compression bondedadjacent to the second end 28 of the transparent portion. Any suitabletechnique or techniques can be utilized to compression bond the secondweld ring 30 to the transparent portion 22, e.g., the same techniquesutilized to compression bond the first weld ring 26 to the transparentportion. The first weld ring 26, transparent portion 22, and second weldring 30 can be disposed over a rod and heated such that the rings andthe transparent portion remain axially aligned while compression bondingoccurs.

Returning to FIGS. 1-3, the package can include one or more externalcontacts disposed on or in such portions. In one or more embodiments,one or both of the opaque portions 18, 20 can be external contacts. Inthe embodiment illustrate in FIGS. 1-3, the package 10 includes a firstexternal contact 42, a second external contact 44, and a third externalcontact 46. The external contacts 42, 44, 46 can be disposed in anysuitable location on or adjacent to the transparent portion 22, thefirst opaque portion 18, the second opaque portion 20, or two or more ofthe transparent portion and the first and second opaque portions of thehousing 12. As illustrated in FIGS. 1-3, the first external contact 42is disposed at the first end 14 of the housing 12 such that it isconnected to the first opaque portion 18. Further, the second externalcontact 44 is disposed at the second end 16 of the housing 12. And thethird external contact 46 is disposed on or in the second opaque portion20 of the housing 12. In one or more embodiments, the second opaqueportion 20 of the housing 12 can provide the third external contact 46,e.g., the second opaque portion can include conductive material toprovide the third external contact. In one or more embodiments, thesecond external contact 44 can be electrically isolated from the thirdexternal contact 46 by an electrically insulative material 48 disposedbetween the second external contact and the third external contact. Theelectrically insulative material 48 can include any suitable material ormaterials that can isolate the second external contact 44 from the thirdexternal contact 46.

The external contacts 42, 44, 46 can include any suitable conductivematerial or materials, e.g., copper, silver, titanium, niobium,zirconium, tantalum, stainless steel, platinum, iridium, or combinationsthereof. In one or more embodiments, the external contacts 42, 44, 46can include two or more materials, e.g., bi-metals, clad laminates, etc.The external contact 42, 44, 46 can include the same material ordifferent materials.

The package 10 can include an electronic device 36 disposed within thehousing 12 in any suitable location such that it is electricallyconnected to the power source 32. As illustrated in FIGS. 1-3, theelectronic device 36 is disposed at least partially within thetransparent portion 22 of the housing 12. In one or more embodiments,additional electronic devices can be disposed within at least one of thefirst and second opaque portions 18, 20 of the housing 12.

Electronic device 36 can include any suitable component or components,electronic circuitry, and one or more conductors that electricallyconnect the components and circuitry to each other. In the embodimentillustrated in FIGS. 1-3, electronic device 36 includes components 52disposed on a substrate 53. The components 52 can each include anysuitable component or electronic circuitry, e.g., capacitors,transistors, integrated circuits, including controllers andmultiplexers, sensors, etc. Further, any suitable number of components52 can be disposed on the substrate 53. In one or more embodiments, theelectronic device 36 can be electrically connected to other electroniccircuitry or devices disposed on or adjacent to the substrate 53 orwithin the housing 12.

Any suitable technique or techniques can be utilized to dispose thecomponents 52 on the substrate 53. In one or more embodiments, thecomponents 52 can be formed on or in the substrate 53. In one or moreembodiments, the components 52 can be formed separately and thenattached to the substrate 53 using any suitable technique or techniques,e.g., a bond can be formed between each component and the substrate.

As mentioned herein, the electronic device 36 can include one or moresensors, e.g., one or more optical sensors. In one or more embodiments,the one or more sensors can be disposed at least partially within thetransparent portion 22 of the housing 12 such that the optical sensorcan detect one or more external conditions, e.g., from a patient whenthe package 10 is disposed within the patient. For example, theelectronic device 36 can include an infrared or near-infrared oxygensensor that can detect through the housing 12 the oxygen level of theblood of the patient. The electronic device 36 can be electricallyconnected to one or more the external contacts 42, 44, 46 using anysuitable technique or techniques.

Further, the package 10 includes the power source 32 disposed in thesecond opaque portion 20 of the housing 12. The package 10 can includeany suitable number of power sources 32. The power source 32 can includeany suitable power source or combination of power sources, e.g., one ormore batteries, capacitors, inductive-coupled energy devices,photovoltaic devices, betavoltaic devices, alphavoltaic devices, andthermo-electric devices. Further, the power source 32 can be disposed inany suitable location within the housing 12. The power source 32 can beelectrically connected to the electronic device 36 and the inductivecoil 34 using any suitable technique or techniques. In one or moreembodiments, the power source 32 can form one or more portions of thehousing 12. For example, in the embodiment illustrated in FIGS. 1-3, thepower source 323 forms the second opaque portion 20

The package 10 can also include one or more tines 50 that are disposedin any suitable location on the housing 12. In one or more embodiments,one or more tines 50 can be connected to the first opaque portion 18 ofthe housing 12 adjacent to the first end 14 of the housing. The tines 50can be utilized to anchor the package 10 to tissue within a patient suchthat the package remains in the desired location after implantation. Thetines 50 can take any suitable shape or shapes. Further, the package 10can include any suitable number of tines 50. The tines 50 can includeany suitable material or materials, e.g., the same materials describedherein regarding the external contacts 42, 44, 46. In such embodiments,the tines 50 can be electrically connected to an external contact usingany suitable technique or techniques. In one or more embodiments, thetines 50 can be attached to the external contact 42 using any suitabletechnique or techniques. In one or more embodiments, the tines 50 can beelectrically insulative.

The package 10 can also include the inductive coil 34. The inductivecoil 34 can be utilized to provide inductive coupling to one or moreexternal devices, e.g., one or more inductive power sources such asinductive charging system 606 of assembly 600 of FIG. 10. The inductivecoil 34 can include any suitable inductive device. The inductive coil 34can be disposed in any suitable location on or within the housing 12. Inone or more embodiments, the inductive coil 34 is disposed at leastpartially within the transparent portion 22 of the housing 12. The term“at least partially within” means that at least a portion of theinductive coil 34 is disposed within the transparent portion 22. In oneor more embodiments, one or more portions of the inductive coil 34 canbe disposed in one or both of the first and second opaque portions 18,20. In one or more embodiments, the entire inductive coil 34 can bedisposed within the transparent portion 22 of the housing 12.

As shown in FIG. 1, the inductive coil 34 is disposed on an innersurface 25 of the transparent portion 22 of the housing 12. Theinductive coil 34 can take any suitable shape or shapes and have anysuitable dimensions. Further, the inductive coil 34 can include anysuitable conductive material or materials, e.g., the same materialsdescribed herein regarding external contacts 42, 44, 46 of package 10 ofFIGS. 1-3. Although shown as disposed on the inner surface 25 of thetransparent portion 22, the inductive coil 34 can be disposed on theouter surface 23 of the transparent portion 22, or on both the innersurface and the outer surface of the transparent portion. Further, theinductive coil 34 can include any suitable number of conductors, e.g.,1, 2, 3, 4, or more discrete conductors.

The inductive coil 34 can be electrically connected to one or morecomponents 52 or power sources of the electronic device 36 and the powersource 32 disposed within the housing 12 of the package 10 using anysuitable technique or techniques. For example, if the inductive coil 34is disposed on the outer surface 23 of the transparent portion 22, a viaor vias can be formed between the outer surface and the inner surface 25of the transparent portion. Conductive material can be disposed withinsuch via or vias that electrically connects the inductive coil 34 to theelectronic device. The inductive coil 34 can be electrically connectedto the vias using any suitable technique or techniques. In embodimentswhere the inductive coil 34 is disposed on the inner surface 25 of thetransparent portion 22, the coil can be electrically connected to theelectronic device 36 and the power source 32 using any suitabletechnique or techniques, e.g., a lead wire or wires can be connected tothe conductor and the electronic device.

In embodiments where the hermetically sealed package 10 includes aninductive coil 34, the package can be a part of any suitable system orassembly that is adapted to provide energy to the package once thepackage is implanted in a patient. For example, FIG. 10 is a schematicview of one embodiment of a hermetically sealed package assembly 600.The assembly 600 includes an implantable medical device 602. Theimplantable medical device 602 can include any suitable device ordevices. In one or more embodiments, the implantable medical device 602can include a hermetically sealed package, e.g., hermetically sealedpackage 10 of FIGS. 1-3. The assembly 600 also includes an inductivecoil 604 that is electrically connected to the implantable medicaldevice 602. In one or more embodiments, the inductive coil 604 can bedisposed within the implantable medical device 602. In one or moreembodiments, the inductive coil 604 can be implanted within the patientseparately from the implantable medical device 602 and electricallyconnected to the implantable medical device utilizing any suitabletechnique or techniques. In one or more embodiments, the inductive coil604 can be disposed within the hermetically sealed package, e.g., theinductive coil 34 can be disposed within transparent portion 22 ofhousing 12 of the hermetically sealed package 10 of FIGS. 1-3. Theassembly 600 also includes an inductive charging system 606. Theinductive charging system 606 can be disposed adjacent to the patientsuch that it is adapted to provide a time-varying magnetic field (e.g.,inductive field) that is capable of inductively charging the implantablemedical device via the inductive coil 604. The inductive charging system606 can be any suitable system, e.g., a flat planar coil, single axisHelmholtz coil, three-axis Helmholtz coil, etc.

All references and publications cited herein are expressly incorporatedherein by reference in their entirety into this disclosure, except tothe extent they may directly contradict this disclosure. Illustrativeembodiments of this disclosure are discussed, and reference has beenmade to possible variations within the scope of this disclosure. Theseand other variations and modifications in the disclosure will beapparent to those skilled in the art without departing from the scope ofthe disclosure, and it should be understood that this disclosure is notlimited to the illustrative embodiments set forth herein. Accordingly,the disclosure is to be limited only by the claims provided below.

What is claimed is:
 1. A hermetically-sealed package, comprising: a housing that extends along a housing axis between a first end and a second end, wherein the housing comprises first and second opaque portions and a transparent portion disposed between the first and second opaque portions, wherein the first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion, wherein at least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring; a power source disposed within the housing; and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
 2. The package of claim 1, wherein the first opaque portion is hermetically sealed to the first end of the transparent portion by a first weld ring and the second opaque portion is hermetically sealed to the second end of the transparent portion by a second weld ring.
 3. The package of claim 2, wherein at least one of the first and second weld rings is diffusion bonded to the transparent portion of the housing.
 4. The package of claim 3, wherein at least one of the first and second weld rings is laser diffusion bonded to the transparent portion of the housing.
 5. The package of claim 2, wherein at least one of the first and second weld rings is compression bonded to the transparent portion of the housing.
 6. The package of claim 1, wherein the transparent portion of the housing is substantially transmissive to electromagnetic radiation having a frequency in a range of 10 kHz to 20 MHz.
 7. The package of claim 1, wherein the inductive coil is disposed on an inner surface of the transparent portion of the housing.
 8. The package of claim 1, wherein the first opaque portion of the housing comprises an external contact adapted to provide an electrical signal to tissue of a patient.
 9. The package of claim 1, wherein the housing comprises an elliptical cross-section in a plane orthogonal to the housing axis.
 10. The package of claim 1, further comprising an external contact hermetically sealed to the second opaque portion of the housing.
 11. The package of claim 1, further comprising a tine connected to the first opaque portion of the housing adjacent to the first end of the housing.
 12. The package of claim 1, wherein the transparent portion of the housing comprises a ceramic material.
 13. The package of claim 1, wherein at least one of the first and second opaque portions of the housing comprises a ceramic material.
 14. A housing assembly, comprising: a housing comprising an outer surface and extending along a housing axis between a first end and a second end; and a weld ring compression bonded to the outer surface of the housing such that the weld ring is hermetically-sealed to the outer surface of the housing.
 15. The assembly of claim 14, further comprising a diffusion layer disposed between the weld ring and the outer surface of the housing that is formed when the weld ring is compression bonded to the outer surface of the housing.
 16. The assembly of claim 14, wherein the housing comprises a ceramic material.
 17. The assembly of claim 14, wherein at least a portion of the housing is substantially transmissive to electromagnetic radiation having a frequency in a range of 10 kHz to 20 MHz.
 18. A method of forming a hermetically-sealed package comprising a housing that extends along a housing axis between a first end and a second end, the method comprising compression bonding a weld ring to an outer surface of a transparent portion of the housing, wherein compression bonding the weld ring comprises: heating the weld ring; disposing the weld ring over the outer surface of the transparent portion of the housing; and cooling the weld ring.
 19. The method of claim 18, wherein bonding the weld ring to the transparent portion of the housing further comprises disposing a metal layer on the outer surface of the transparent portion of the housing prior to disposing the weld ring over the outer surface of the transparent portion of the housing such that the metal layer is disposed between the weld ring and the outer surface of the transparent portion of the housing.
 20. The method of claim 18, further comprising compression bonding a second weld ring to the outer surface of the transparent portion of the housing, wherein the first weld ring is compression bonded to a first end of the transparent portion of the housing and the second weld ring is compression bonded to a second end of the transparent portion of the housing, wherein compression bonding the second weld ring comprises: heating the second weld ring; disposing the second weld ring over the outer surface of the transparent portion of the housing; and cooling the second weld ring. 